Artificial Intelligence Hardware (AIHW) Call for Research

Funding Agency:
Semiconductor Research Corporation

Semiconductor Research Corp. (SRC) Artificial Intelligence Hardware Program (AIHW) member companies are pleased to solicit white papers for possible funding in 2023.

The call is open to all domestic and foreign universities and may be addressed by an individual investigator or a research team. Our selection process is divided into two stages. Interested parties are requested to submit a 1-page white paper, which should identify what can be done in a three-year period beginning January 1, 2024. A successfully selected white paper will result in an invitation to submit a full proposal. These proposals will be further down selected for SRC research contracts.

These projects will address existing and emerging challenges in information and communication technologies (ICT) and associated technologies, as outlined in the Decadal Plan for Semiconductors, and accelerating innovation in application. SRC and a consortium of industry experts have refined these seismic shifts into the Microelectronic and Advanced Packaging Technologies (MAPT) Roadmap. MAPT is a critical multidisciplinary field with the potential to transform the design and manufacture of future microchips. The interim report is now available ( and will be used as a guide for future research activities.

It is the intention of the members for selected projects to be reviewed and renewed annually, but we anticipate that a project will have a lifetime of 3 years which should help support a mix of research scholars.  SRC projects typically involve 1 or more research scholars doing a variety of doctoral dissertations, graduate research, undergraduate projects, and some post-doctoral work.  

SRC expects to support each project at $105K (USD) per year.  The number of the contracts awarded will be determined by the availability of funds, the support of the research needs, and by the number of high-quality proposals. Proposals offering funding leverage (other funding resources related and beneficial to the proposed work) are encouraged and details should be described (ex. Fellowships, student support, fabrication support, etc.).  

Deadline for White Papers: May 1, 2023

Agency Website

Funding Type





Engineering and Physical Sciences

External Deadline

May 1, 2023