Magnetic Miniaturized and Monolithically-Integrated Components (M3IC)

Funding Agency:
Defense Advanced Research Projects Agency

The DARPA Microsystems Technology Office is soliciting innovative research proposals to develop integrated magnetic components on semiconductor substrates that will reduce size and enable new functionality for U.S. Department of Defense (DoD) electromagnetic (EM) systems. Proposals will focus on one or more of the following technical areas: 1) integration of magnetic components on semiconductor substrates, 2) modeling the system-level impact of nonlinear, non-reciprocal, time-dependent magnetic phenomena, and 3) optimization of miniaturized microwave magnetic components. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.

Deadline: Aug. 1, 2016

Agency Website

Amount Description

Multiple awards are anticipated. The amount of resources made available under this BAA will depend on the quality of the proposals received and the availability of funds. 

Funding Type





Engineering and Physical Sciences

External Deadline

August 1, 2016