Sponsor Deadline
Posted: 3/25/2025

Microsystems Technology Office (MTO) Office-wide Broad Agency Announcement

The Microsystems Technology Office (MTO) at DARPA regularly publishes BAAs requesting responses to specific program topics. This announcement seeks revolutionary research ideas for topics not addressed by ongoing MTO programs or other published BAA solicitations.

Since its inception in 1991, MTO has helped create and prevent strategic surprise through investments in compact microelectronic components such as microprocessors, microelectromechanical systems (MEMS), and photonic devices. MTO’s revolutionary work applying advanced capabilities in areas such as wide-band gap materials, phased array radars, high-energy lasers, and infrared imaging have helped the United States establish and maintain technological superiority for more than two decades.

MTO seeks to develop high-risk, high-reward technologies that continue DARPA’s mission of creating and preventing strategic surprise, help to secure the Department of Defense’s (DoD) technological superiority, and address the complex threats facing U.S. national security. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices, or systems. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.

Deadlines:

o Abstract Due Date: Abstracts may be submitted on a rolling basis until 1:00 p.m. on August 9, 2025
o Proposal Due Date: Proposals may be submitted on a rolling basis until 1:00 p.m. on October 9, 2025

Areas of Interest

Research areas of current interest to MTO include, but are not limited to, the following topics:
 

Quantum circuits
 Interconnect technologies for transferring quantum states between qubit platforms
 Generalizable improvements for processing chain for all types of quantum sensors
 High density low loss mixed signal transfer between room and quantum temperatures
 

Biological circuits
 High throughput molecular readers for full spectrum sequencing
 3-dimensional bio-templated self-assembly of microsystems
 Highly-parallel DNA writing platforms for long DNA writes for genome-scale
complexity with low error
 

Photonic circuits
 Applications for purely photonic circuits not realizable in electronic circuits
 Chip scale photonics for ultralow noise microwave sources
 Tunable chip scale ultrafast (<10 ps) lasers
 Fiber-inspired ultralow loss integrated photonics


Manufacturing Ecosystem
 Litho- and etch-free direct nanoscale semiconductor manufacturing
 Low-loss high permeability/permittivity materials
 High density cryogenic-to-room-temperature interconnects
 Atomically precise, multi-chemistry molecular manufacturing technologies
 Energy reclamation from low-grade waste heat
 Reconfigurable multiscale manufacturing for onshore manufacturing
 

Dual Use by Design
 All-weather long distance high bandwidth communications
 Commercially relevant tool development challenge problems
 Conformal and malleable batteries
 Design and assembly of complex microsystems in supply-chain-free
environments
 Reconfigurable additive manufacturing for multiple classes of materials
 Context aware imaging