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Millimeter-Wave Digital Arrays (MIDAS)
The Defense Advanced Research Projects Agency (DARPA) often selects its research efforts through the Broad Agency Announcement (BAA) process. This BAA is being issued, and any resultant selection will be made, using the procedures under Federal Acquisition Regulation (FAR) 6.102(d)(2) and 35.016 and 2 C.F.R. § 200.203. Any negotiations and/or awards will use procedures under FAR 15.4, Contract Pricing. Proposals received as a result of this BAA shall be evaluated in accordance with evaluation criteria specified herein through a scientific review process.
The Microsystems Technology Office at DARPA seeks innovative proposals that explore the extent to which multi-beam systems can be employed at millimeter wave over extremely wide ranges of frequencies, which necessitates digitization within the array itself. A reduction in size and power of digital transceivers at millimeter wave is expected and will likely involve innovative sampling and frequency conversion schemes to meet the linearity requirements. The primary goal of the program is to develop and demonstrate a tile building block sub-array (>16 elements) that supports scaling to large arrays (100’s-10,000+) in the 18-50 GHz band and does not eliminate spatial degrees of freedom within the sub-array. It is expected that this will be enabling hardware for multi-function, multi-beam phased array applications and emerging massive multiple-inputmultiple-output (MIMO) techniques in communication and sensing.
Proposal Due Date: March 26, 2018
Areas of Interest
- Technical Area 1: Wideband Millimeter Wave Digital Tiles, 36 months
- Technical Area 2: Wideband Millimeter Wave Apertures, 48 Months
- Technical Area 3: Millimeter Wave Array Fundamentals, 36 Months
Collaborative efforts/teaming are strongly encouraged. As the program emphasizes multidisciplinary approaches, a successful proposal must demonstrate sufficient expertise in all requisite technical specialties. At a minimum, excellent credentials must be demonstrated in:
- RF system design, RF and mixed-signal circuit design in advanced CMOS processes.
- RF transmit and receive component development in compound semiconductor processes. Advanced packaging and manufacturing techniques to include electromagnetic design of wideband antenna arrays and thermal design considerations.
- Phased-array testing and calibration experience.